Suggested Reflow Conditions

SMD Products Reflow Profile


The reflow temperature profile may vary depending on the product model, specifications and frequency range.
Please consult us for further information.

Heat Reststance Thru-Hole Products

All our Through-hole products use solder with a melting point of +180°C to +200°C.
Heating up the package more than +150°C may deteriorate the characteristics or even damage the products .
We recommend to use our SMD products if you use soldering procedures of more than 150°C.