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Saturday, 25 May 2013

Suggested Reflow conditions

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SMD PRODUCTS REFLOW PROFILE

reflow

The reflow temperature profile may vary depending on the product model, specifications and frequency range.
Please consult us for further information.

 

 

HEAT RESISTANCE THRU-HOLE PRODUCTS

All our Through-hole products use solder with a melting point of +180°C to +200°C.
Heating up the package more than +150°C may deteriorate the characteristics or even damage the products .
We recommend to use our SMD products if you use soldering procedures of more than 150°C.